XCZU9CG-1FFVC900I Litlhaloso tsa Tech

IC FPGA 204 I/O 900FCBGA

Sehlahisoa Tšobotsi Boleng ba Tšobotsi
Category Integrated Circuits (ICs) / Inbedded - System On Chip (SoC)
Manufacturer Xilinx
Factory Lead Time 3 Weeks
Supplier Device Package 900-FCBGA (31x31)
Series Zynq® UltraScale+™ MPSoC CG
Peripherals DMA, WDT
Package / Case 900-BBGA, FCBGA
Number of I/O 204
MCU Flash -
Connectivity CAN, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Sehlahisoa Tšobotsi Boleng ba Tšobotsi
Part Status Active
RoHS Status ROHS3 Compliant
Pbfree Code yes
Speed 533MHz, 1.3GHz
Primary Attributes Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
Packaging Tray
Operating Temperature -40°C ~ 100°C (TJ)
MCU RAM 256KB
Core Processor Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Architecture MCU, FPGA
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Karolo # Moetsi Sehlopha Ho fumaneha
XCZU9CG-1FFVB1156E Xilinx Inbedded - System On Chip (SoC) 2621
XCZU9CG-1FFVB1156E Xilinx Inc. SoC
XCZU9CG-1FFVB1156I Xilinx Inbedded - System On Chip (SoC) 2547
XCZU9CG-1FFVB1156I Xilinx Inc. SoC
XCZU9CG-1FFVC900E Xilinx Inbedded - System On Chip (SoC) 2516
XCZU9CG-1FFVC900E Xilinx Inc. SoC
XCZU9CG-1FFVC900I Xilinx Inc. SoC
XCZU9CG-2FFVB1156E Xilinx Inbedded - System On Chip (SoC) 2795
XCZU9CG-2FFVB1156E Xilinx Inc. SoC
XCZU9CG-2FFVB1156I Xilinx Inbedded - System On Chip (SoC) 1127

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