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XCZU7CG-1FBVB900I Litlhaloso tsa Tech

IC FPGA 204 I/O 900FCBGA

Sehlahisoa Tšobotsi Boleng ba Tšobotsi
Category Integrated Circuits (ICs) / Inbedded - System On Chip (SoC)
Manufacturer Xilinx
Factory Lead Time 3 Weeks
Supplier Device Package 900-FCBGA (31x31)
Series Zynq® UltraScale+™ MPSoC CG
Peripherals DMA, WDT
Package / Case 900-BBGA, FCBGA
Number of I/O 204
MCU Flash -
Connectivity CAN, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Sehlahisoa Tšobotsi Boleng ba Tšobotsi
Part Status Active
RoHS Status ROHS3 Compliant
Pbfree Code yes
Speed 533MHz, 1.3GHz
Primary Attributes Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Packaging Tray
Operating Temperature -40°C ~ 100°C (TJ)
MCU RAM 256KB
Core Processor Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Architecture MCU, FPGA
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XCZU7CG-1FBVB900I baetsi ba lihlahisoa: Xilinx, Bonchip setokong, XCZU7CG-1FBVB900I theko ea litšupiso. XCZU7CG-1FBVB900I mekhahlelo, XCZU7CG-1FBVB900I Datasheet PDF le pin diagram tlhaloso download.U ka sebelisa the XCZU7CG-1FBVB900I Li-plugable Connectors, DSP Datesheet PDF, fumana XCZU7CG-1FBVB900I Setšoantšo sa pin le setšoantšo sa potoloho le mokhoa oa ts'ebeliso ea ts'ebetso, XCZU7CG-1FBVB900I lisebelisoa tsa elektronike.U ka khoasolla ho tloha ho Bonchip.
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