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MPC940LAC Litlhaloso tsa Tech

MPC940LAC datasheet pdf and Clock/Timing - Application Specific product details from Integrated Device Technology (IDT) stock available at Bonchip

Sehlahisoa Tšobotsi Boleng ba Tšobotsi
Category Integrated Circuits (ICs) / Applikasjon Spesifikk Timer
Manufacturer Integrated Device Technology (IDT)
Factory Lead Time 3 Weeks
Contact Plating Tin
Package / Case TQFP
Weight 72.801575mg
JESD-609 Code e3
Part Status Discontinued
Number of Terminations 32
Max Operating Temperature 70°C
Additional Feature ALSO OPERATES AT 3.3V SUPPLY
Technology BICMOS
Terminal Form GULL WING
Number of Functions 1
Terminal Pitch 0.8mm
Pin Count 32
Power Supplies 2.5/3.3V
Number of Circuits 1
Min Supply Voltage 2.375V
Propagation Delay 5.2 ns
Frequency (Max) 250MHz
Input LVCMOS
Max I(ol) 0.02 A
Same Edge Skew-Max (tskwd) 0.2 ns
Length 7mm
Thickness 1.4mm
RoHS Status RoHS Compliant
Sehlahisoa Tšobotsi Boleng ba Tšobotsi
Part Status Active
RoHS Status ROHS3 Compliant
Pbfree Code yes
Mount Surface Mount
Number of Pins 32
Published 2001
Pbfree Code yes
Moisture Sensitivity Level (MSL) 3
ECCN Code EAR99
Min Operating Temperature 0°C
Subcategory Clock Drivers
Terminal Position QUAD
Peak Reflow Temperature (Cel) 260
Supply Voltage 2.5V
[email protected] Reflow Temperature-Max (s) 30
Number of Outputs 18
Temperature Grade COMMERCIAL
Max Supply Voltage 3.465V
Operating Supply Current 20mA
Quiescent Current 1mA
Family 940
Logic IC Type LOW SKEW CLOCK DRIVER
Duty Cycle (Max) 60 %
Height 1.4mm
Width 7mm
Radiation Hardening No
Lead Free Lead Free
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Tse ling li kenyelletsa   "MPC94"   likarolo

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MPC940LAC baetsi ba lihlahisoa: Integrated Device Technology (IDT) , Bonchip setokong, MPC940LAC theko ea litšupiso. MPC940LAC mekhahlelo, MPC940LAC Datasheet PDF le pin diagram tlhaloso download.U ka sebelisa the MPC940LAC Li-plugable Connectors, DSP Datesheet PDF, fumana MPC940LAC Setšoantšo sa pin le setšoantšo sa potoloho le mokhoa oa ts'ebeliso ea ts'ebetso, MPC940LAC lisebelisoa tsa elektronike.U ka khoasolla ho tloha ho Bonchip.
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